After Apple’s autumn conference, the popularity of the iPhone 16 series has not diminished, and the market has already discussed the iPhone 17 series in advance. On September 18, CNMO learned that industry sources said that Apple has booked the first batch of production capacity of TSMC’s 2nm and subsequent A16 processes, indicating that the iPhone 17 Pro series, which will be released as early as next year, will be fully equipped with chips using advanced 2nm technology.
It is reported that TSMC’s 2nm process technology has entered the final sprint stage and plans to start mass production at the Baoshan plant in Hsinchu next year. TSMC said that compared with the N3E process, the N2 process can achieve a 10% to 15% performance improvement while maintaining the same power consumption, and can reduce power consumption by 25% to 30% while maintaining the same performance.
What is more worth mentioning is that TSMC’s 2nm process will also introduce innovative SoIC packaging technology, which allows multiple chips to be stacked vertically and achieve efficient electrical connections through silicon via (TSV) technology to form a compact three-dimensional integrated system. This cutting-edge technology not only greatly improves the integration and functionality of the chip, but also significantly reduces the energy consumption and response time of the entire system.
Although the iPhone 17 series is still a year away from release, discussions on the Internet are already in full swing. It is rumored that the iPhone 17 Pro Max may use graphene sheets as an innovative heat dissipation solution. This move is regarded as a major breakthrough for Apple in solving the problem of mobile phone heat dissipation, which has aroused the amazement and expectations of many netizens.
In addition, the iPhone 17 series is rumored to be equipped with up to 12GB of RAM and plans to introduce more Edge AI technologies to enhance the edge computing capabilities of the device. Please note that the above information is early news and its authenticity remains to be seen.
